Etching

Results: 756



#Item
21Vol. 25 • No. 9 • March 4 • 2015  www.afm-journal.de Advanced Functional Materials, Vol. 25, 2015, No. 9, pages 1329–1472	 www.afm-journal.de

Vol. 25 • No. 9 • March 4 • 2015 www.afm-journal.de Advanced Functional Materials, Vol. 25, 2015, No. 9, pages 1329–1472 www.afm-journal.de

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2015-03-10 06:24:40
22etchIDENT stencils allow you to permanently etch your VIN (vehicle identification number) onto your

etchIDENT stencils allow you to permanently etch your VIN (vehicle identification number) onto your

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Source URL: www.boslerinc.com

Language: English - Date: 2012-02-28 23:43:21
23Produktblatt_CMP2016.indd

Produktblatt_CMP2016.indd

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Source URL: www.screening-fab.com

Language: English - Date: 2016-06-30 03:47:51
24A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan

A Demonstration of Broadband RF Sensing: Empirical Polysilicon Etch Rate Estimation in a Lam 9400 Etch Tool Craig Garvin and J. W. Grizzle Department of Electrical Engineering and Computer Science, University of Michigan

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Source URL: web.eecs.umich.edu

Language: English - Date: 2016-04-25 13:15:11
25Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En

Compensation for transient chamber wall condition using realtime plasma density feedback control in an inductively coupled plasma etcher Pete I. Klimecky, J. W. Grizzle, and Fred L. Terry, Jr. Department of Electrical En

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Source URL: web.eecs.umich.edu

Language: English - Date: 2016-04-25 13:15:14
26Microsoft Word - Know-how Infodoc

Microsoft Word - Know-how Infodoc

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Source URL: www.meab-mx.se

Language: English - Date: 2010-01-10 06:56:54
27High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

High-Aspect Ratio Deep Sub-Micron α-Si Gate Etch Process Control H.-M. Park, T. L. Brock, D. Grimard, J. W. Grizzle and F. L. Terry, Jr University of Michigan 195th Spring Meeting of ECS

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Source URL: web.eecs.umich.edu

Language: English - Date: 2016-04-25 13:15:12
28To:  A ll N anofab Users From: Tom Reynolds ESB Room 1109E, Ext 3918

To: A ll N anofab Users From: Tom Reynolds ESB Room 1109E, Ext 3918

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Source URL: www.nanotech.ucsb.edu

Language: English - Date: 2016-03-21 12:47:27
29Microcontact Printing: Arrays of Silicon Micro/Nanostructures Formed in Suspended Configurations for Deterministic Assembly Using Flat and RollerType Stamps (Small)

Microcontact Printing: Arrays of Silicon Micro/Nanostructures Formed in Suspended Configurations for Deterministic Assembly Using Flat and RollerType Stamps (Small)

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Source URL: rogers.matse.illinois.edu

Language: English - Date: 2011-03-01 06:52:52
30Management of Voids in Processing of Bonded Wafers Dr. Shari Farrens, Chief Scientist, EV Group Inc. Dr. Lawrence W. Kessler, President, Sonoscan, Inc. Abstract This paper discusses the origination and detection of bondi

Management of Voids in Processing of Bonded Wafers Dr. Shari Farrens, Chief Scientist, EV Group Inc. Dr. Lawrence W. Kessler, President, Sonoscan, Inc. Abstract This paper discusses the origination and detection of bondi

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Source URL: www.sonoscan.com

Language: English - Date: 2016-07-20 11:09:32