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Enhanced adhesion with pedestal-shaped elastomeric stamps for transfer printing Seok Kim, Andrew Carlson, Huanyu Cheng, Seungwoo Lee, Jung-Ki Park et al. Citation: Appl. Phys. Lett. 100, ); doi:
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Document Date: 2012-04-26 10:56:06
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File Size: 1,25 MB
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