| Document Date: 2013-11-13 17:12:25
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City Pasadena / London / Grenoble / / Company ðTMISI-MISM aMISI Lc / France Thomas J. Watson Laboratories / J. Grandidier S. P. / AIP Publishing / USA 3 Jet Propulsion Laboratory / / Country United States / / Currency USD / / / Facility American Institute / MINATEC Campus / California Institute of Technology / American Institute of Physics / / IndustryTerm metal / gate metal / metal-insulator-silicon-insulator structure / metal-oxide-silicon technology processes / metal-insulator-metal waveguides / metal-oxide-semiconductor / metal-insulator-silicon-metal plasmonic / low-pressure chemical vapor deposition / metal deposition / chemical mechanical polishing / modified butt coupling scheme employing copper-based metal-insulator-silicon-insulator / integrated plasmon-assisted devices / hybrid plasmonic devices / electronic devices / chemical etching / electronics / chemical vapor deposition / final device / electro-chemical deposition / metal-silicon-insulator / optical interconnect technologies / back metal contact / waveguide devices / copper electro-chemical deposition / energy / fabricated using complementary metal-oxide-silicon technology processes / planarized using chemical mechanical polishing / / Organization California Institute of Technology / American Institute of Physics / French National Agency / / Person Karl Suss / / Product Harman Reference 220 Headphone/Headset / / ProvinceOrState California / / PublishedMedium Applied Physics Letters / / Region East California / / Technology semiconductor / optical interconnect technologies / laser / CMOS technology / dielectric / chemical mechanical polishing / photolithography / integrated circuits / multimode fiber / chemical vapor deposition / / URL http /
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