process technologies / high gas flow / gas flow / incident gas species / gas species / carrier wafer / guard devices / carrier layer / wet chemical means / aspectratio silicon devices / energy / metal / metal layer / chemical reactions / process technology / gas flow rate / chemical mechanical polishing / energy decreases / continuous gas flow / Energy harvesting devices / carrier wafers / wet processing / then be polished using chemical mechanical polishing / /
Organization
University of Michigan / / /
Position
guard / /
ProvinceOrState
Pennsylvania / /
Technology
semiconductor / radiation / SOI technology / chemical mechanical polishing / Lithography / SOS process technology / MEMS / dielectric / process technologies / /
A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding