| Document Date: 2009-03-25 10:39:38
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City Paris / / Company IBM / Philips Semiconductors / Infineon Technologies / STMicroelectronics / / Continent Europe / / Country United States / / / Facility DAM CEA-LETI CISSOID ETH Zurich Freescale Semiconductors IEMN IMEP Infineon Technologies NXP / / / IndustryTerm nm products / multiband systems / ance applications / ultra low power applications / technology integration / nm applications / low voltage/low power applications / volume products / parasitic bipolars applications / electronics / high speed computing / thin junctions ume applications / analogue applications / computing / wafers ance applications / / Organization Information Society / The Netherlands Sweden Switzerland EUREKA MEDEA+ Office / / Person Eugene Mackowiak / / / Position PROJECT LEADER / leader / co-operative / / PublishedMedium the Information Society / / Technology bulk CMOS technology / ilicon-on-insulator CMOS technology / also producing performance CPU chips / key technology / SOI technology / mobile phones / RF technology / GSM / SRAM / SOI-based chips / integrated circuit / / URL http /
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PROJECT RESULT IC technology integration T206: CMOS SOI for low power logic and