Eutectic bonding
Results: 4
| # | Item |
|---|---|
1 | Imaging Bonded Wafer Defects for 3-D A practical, acoustic imaging technique is applied to bonded wafer pairs to image interface defects and wafer scratches in various materials. he range of products whose fabricationAdd to Reading ListSource URL: www.sonoscan.comLanguage: English - Date: 2016-07-20 11:09:32 |
2 | SEMI-FINISHED BONDED SUBSTRATES: SOI-WAFER (SILICON ON INSULATOR) 1Add to Reading ListSource URL: www.enas.fraunhofer.deLanguage: English - Date: 2015-01-15 09:59:22 |
3 | THERMOCOMPRESSION WAFER BONDING WITH THIN METAL LAYERS ContactAdd to Reading ListSource URL: www.enas.fraunhofer.deLanguage: English - Date: 2015-01-15 06:04:42 |
4 | SEMI-FINISHED BONDED SUBSTRATES Silicon LiTaO3 100 µmAdd to Reading ListSource URL: www.enas.fraunhofer.deLanguage: English - Date: 2015-01-15 05:44:20 |